Title :
Board Level FBGA Package Combined Thermal Cycling & Bending Fatigue Study
Author :
Wang, Hui ; Zhou, Jianwei ; Lee, Taekoo ; Wang, Jun ; Xiao, Fei
Author_Institution :
Samsung Semicond. China R&D Co. Ltd., Suzhou
Abstract :
A combined thermal cycling and bending fatigue test method is proposed for board level FBGA package. The fatigue lifetime of the board level FBGA package is studied with the combined acceleration method both with experimental and numerical analysis. The influence of initial pre-temperature cycling treatment on the bending fatigue life is studied. The failure analysis of failed samples was conducted, cracks were found in different sites of the package. The numerical analysis of the combined temperature cycle test and bending test was conducted. The simulation results of fatigue lifetime and failure site correspond to the experiment result well
Keywords :
ball grid arrays; fatigue testing; bending fatigue test; fine pitch ball grid array package; temperature cycle test; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Failure analysis; Fatigue; Packaging machines; Semiconductor device packaging; System testing; Temperature; Thermal loading;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564672
