DocumentCode :
2849497
Title :
Packaging technology of polymer/Si arrayed waveguide grating and their environmental stability
Author :
Zhang, Daming ; Wang, Fei ; Yuguo Zhang ; Xizhen Zhang ; Deng, Wenyuan ; Shulin, E.
fYear :
2005
fDate :
30 Aug.-2 Sept. 2005
Firstpage :
99
Lastpage :
101
Abstract :
In this paper we present the fabrication process and the measuring result of a 32 channel fluorinated FPEEK AWG multiplexer at the central wavelength of 1550 nm. For our AWG, the insertion loss is 12.8-17.8 dB and the crosstalk less than -20 dB. We fabricated the AWG multiplexer by spin coating, photolithographic patterning and reactive ion etching (RIE). The roughness of polymer waveguide endface was reduced by polishing. The polymer AWG´s package technology and environmental stability were also discussed.
Keywords :
arrayed waveguide gratings; electronics packaging; environmental degradation; multiplexing equipment; photolithography; polishing; polymers; silicon; spin coating; 12.8 to 17.8 dB; 1550 nm; AWG multiplexer; Si; arrayed waveguide grating; environmental stability; fabrication process; photolithographic patterning; polishing; polymer package technology; polymer waveguide; reactive ion etching; spin coating; surface roughness; Arrayed waveguide gratings; Coatings; Crosstalk; Fabrication; Insertion loss; Multiplexing; Packaging; Polymers; Stability; Wavelength measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
Type :
conf
DOI :
10.1109/ICEPT.2005.1564673
Filename :
1564673
Link To Document :
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