Inductor Design Optimization for RFIC Application

Author

Lee, Yung-Huei ; Lu, Yin-Lung Ryan ; McMahon, William

fYear

2007

fDate

23-25 April 2007

Firstpage

1

Lastpage

2

Abstract

This paper investigates an electromigration (EM) hardened design optimization for integrated circuit inductors. Inductor layouts that utilize a metal reservoir and a stack via/metal have improved EM performance and heat dissipation. The improvement can be converted to inductor scaling and RFIC die size reduction. High-frequency measurements indicate that the new inductor layout design does not affect the inductor-Q and circuit power gain. Computer simulation farther validates the robust performance of the scaled inductor and the RFIC circuits.

Keywords

cooling; electromigration; inductors; optimisation; radiofrequency integrated circuits; EM; RFIC application; circuit power gain; electromigration; heat dissipation; inductor design optimization; inductor scaling; integrated circuit inductors; metal reservoir; robust performance; Computer simulation; Design optimization; Electromigration; Gain measurement; Inductors; Integrated circuit measurements; Power measurement; Radiofrequency integrated circuits; Reservoirs; Robustness;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on

Conference_Location

Hsinchu

ISSN

1524-766X

Print_ISBN

1-4244-0584-X

Electronic_ISBN

1524-766X

Type

conf

DOI

10.1109/VTSA.2007.378946

Filename

4239514