• DocumentCode
    2849780
  • Title

    Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs

  • Author

    Wan, Lixi ; Markondeya Raj, P. ; Swaminathan, M. ; Tummala, R.

  • Author_Institution
    Package Res. Center, Georgia Tech., USA
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    108
  • Lastpage
    112
  • Abstract
    Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.
  • Keywords
    capacitors; chip-on-board packaging; measurement errors; printed circuit manufacture; 0.001 to 1 GHz; PCB; embedded capacitor; embedded decoupling capacitors; error elimination; measurement error; measurement techniques; multi-GHz packages; power delivering network; Capacitors; Dielectric materials; Electrodes; Frequency; Inductance; Low-frequency noise; Measurement errors; Measurement techniques; Packaging; Parasitic capacitance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564691
  • Filename
    1564691