Title :
Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs
Author :
Wan, Lixi ; Markondeya Raj, P. ; Swaminathan, M. ; Tummala, R.
Author_Institution :
Package Res. Center, Georgia Tech., USA
fDate :
30 Aug.-2 Sept. 2005
Abstract :
Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.
Keywords :
capacitors; chip-on-board packaging; measurement errors; printed circuit manufacture; 0.001 to 1 GHz; PCB; embedded capacitor; embedded decoupling capacitors; error elimination; measurement error; measurement techniques; multi-GHz packages; power delivering network; Capacitors; Dielectric materials; Electrodes; Frequency; Inductance; Low-frequency noise; Measurement errors; Measurement techniques; Packaging; Parasitic capacitance;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564691