DocumentCode :
2849893
Title :
Drop Test and Simulation of Portable Electronic Devices
Author :
Liu, Sheng ; Wang, Xiaojun ; Bin Ma ; Gan, Zhiyan ; Zhang, Honghai
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI
fYear :
2005
fDate :
2-2 Sept. 2005
Firstpage :
1
Lastpage :
4
Abstract :
Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc. Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. The experiment test and the modeling simulation study are conducted to investigate the effect of drop impact of portable electronic devices. A sample pump as an example is used for drop impact test. Of interest is the measurement of the level of shock and the impact orientation experienced by the electronic components in the insulin pump during impact. The drop impact responses examined are compared with the modeling simulation results. Also, another simulation modeling of the cellphone is given with particular focus on the material rate dependent constitute modeling, and nonlinear contact mechanics based modeling. Maximum impact accelerations and impact forces demonstrated with various impact orientations shows what is the relative reliability of cellphone during the different impact situations
Keywords :
cellular radio; conformance testing; impact testing; portable instruments; printed circuit testing; product design; cellphone reliability; drop behaviors; drop impact test; failure mechanisms; impact accelerations; impact forces; impact orientations; nonlinear contact mechanics modeling; portable electronic devices; product design; Acceleration; Batteries; Cellular phones; Displays; Electric shock; Electronic components; Electronic equipment testing; Failure analysis; Insulin; Product design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
Type :
conf
DOI :
10.1109/ICEPT.2005.1564699
Filename :
1564699
Link To Document :
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