DocumentCode :
2849954
Title :
A novel Z-axis capacitive accelerometer using-SOG structure
Author :
Weiping, Chen ; Mingxue, Huo ; Yumin, Lin ; Xiaowei, Liu ; Ruichao, Zhang
Author_Institution :
MEMS Center, Harbin Inst. of Technol., China
fYear :
2005
fDate :
30 Aug.-2 Sept. 2005
Firstpage :
105
Lastpage :
107
Abstract :
A differential capacitive silicon z-axis micro-accelerometer using SOG (silicon on glass) structure, based on bulk micromachining technology is proposed and a novel structure is designed. The device with a three-layer structure can provide a variable sensitivity as changing the thickness of the beam fabricated, by only one set of masks. The simulation of the static and modal performance of the accelerometer structure is completed with the FEM (finite element method) and the optimized design of the accelerometer is accomplished. The key techniques in the fabrication are investigated and the process flow is designed, furthermore, corner compensation structure was used in the masks to avoid convex corner undercutting, which is simulated and optimized by process simulation (IntelliSuite). The mechanical sensitivity of the accelerometer varies from 2.37×10-7/w/gn to 1.74 ×10-8m/gn as the thickness of the beam from 50μm to 20μm.
Keywords :
accelerometers; capacitive sensors; digital simulation; finite element analysis; glass; micromachining; microsensors; semiconductor process modelling; sensitivity; silicon-on-insulator; IntelliSuite; bulk micromachining technology; capacitive accelerometer; finite element method; mechanical sensitivity; microaccelerometer; process flow; process simulation; silicon on glass structure; Acceleration; Accelerometers; Capacitive sensors; Design optimization; Fabrication; Glass; Linearity; Micromachining; Silicon; Structural beams; Accelerometer; FEM; Simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
Type :
conf
DOI :
10.1109/ICEPT.2005.1564703
Filename :
1564703
Link To Document :
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