Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy

Author

Keke, Zhang ; Guanghui, Cheng ; Yangchun, Yu ; Yanfu, Yan ; Hua, Man

Author_Institution

Sch. of Mater. Sci. & Eng., Henan Univ. of Sci. & Technol., Luoyang

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

4

Abstract

In the study the fabrication, microstructure, mechanical and physical properties and wettability of Sn_2.0Ag_0.7CuRE solder alloy are investigated. Result shows that when the content of RE<0.1%(mass fraction), RE distributes uniformly in the solder alloy, and the tensile strength and conductance of Sn_2.0Ag_0.7CuRE solder alloy are better than those of traditional Sn³⁷Pb solder. Its elongation and spreading area are almost equal to that of Sn³⁷Pb. When the content of RE reaches 0.5%, RE compounds can be easily found around the boundaries of grains and phases. The tensile strength and elongation and spreading area of Sn_2.0Ag_0.7CuRE solder alloy all decrease sharply. Therefore, RE amount added to the Sn_2.0Ag_0.7CuRE solder alloy under 0.1% is proper

Keywords

copper alloys; lead alloys; materials testing; rare earth alloys; silver alloys; solders; tensile strength; tin alloys; rare earth; solder alloy; tensile strength; Environmentally friendly manufacturing techniques; Fabrication; Lead; Materials science and technology; Mechanical factors; Microstructure; Optical microscopy; Production; Scanning electron microscopy; Surface-mount technology; SnAgCuRE solder alloy; microstructure; properties; rare earth;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564711

Filename

1564711