Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Author

Zhang, Xueren ; Tee, Tong Yan ; Luan, Jing-En

Author_Institution

STMicroelectronics, Singapore

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

6

Abstract

Packaging of MEMS (micro-electro-mechanical system) devices poses more challenges than conventional TC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A land grid array (LGA) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled

Keywords

accelerometers; electronics packaging; finite element analysis; microassembling; micromechanical devices; accelerometer application; finite element modeling; land grid array package; linear multiaxis accelerometer; matrix block warpage; micro-electro-mechanical system; package warpage; stacked die MEMS package; warpage analysis; Accelerometers; Design methodology; Design optimization; Electronics packaging; Finite element methods; Integrated circuit packaging; Manufacturing processes; Microelectromechanical devices; Micromechanical devices; Personal digital assistants;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564716

Filename

1564716