Vision based Integrated System for Automated Anodic Bonding of MEMS Sensors

Piezoresistive silicon pressure sensors are widely used in automotive, aerospace and medical equipment industries. Batch bonding of the sensors is limited by the manual manipulation required specially trained technicians. In order to reduce the production costs and simultaneously obtain high production quality, a vision based integrated system for automated anodic bonding is presented. This system consists of a vision subsystem, macro/micro stages, a vacuum micromanipulator, and some additional subsystems. The macro/micro stage performs fine positioning and bonding under the navigation of the vision, the vacuum micromanipulator integrated with smart force sensor can perform highly-precise bonding tasks and a nondestructive transportation of the chip and the quartz base. To perform manipulations automatically, a control system, including a task planning level and a real-time execution level, was developed. The automated batch bonding is validated by further experiment