All silicon multi chip module with a fully integrated cooling system

This paper proposes a novel silicon-on-silicon multichip module with an integrated thermal management system. Our module offers a new packaging approach, which allows great densification of the number of electronic circuits on a common substrate that is almost equivalent to wafer scale integration, yet uses discrete chips. Wet anisotropic etching is used for the separation of silicon integrated circuits as well as for the fabrication of the chip-receiving cavities in the MCM substrate. The etching exposes Si{111} planes in both chip and receiving surface, assuring a virtually perfect mating of the assemblage. The system is complemented with an integrated cooling channel which allows the removal of heat fluxes up to 300 Wcm^-2