UV Laser Solutions for Electronic Interconnect and Packaging

Author

Lei, Weisheng ; Raman, Sudhakar ; Chow, Curry

Author_Institution

Electro Sci. Ind. Inc., Portlang, OR

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

7

Abstract

A UV laser can machine a wide variety of circuit board materials and the UV laser beam can be finely focused to generate very small features. These unique capabilities in combination enable the UV laser technology to provide a variety of efficient solutions for electronic interconnect and packaging applications that are driven by increased high density and high speed signaling requirements. Several 355nm UV laser based micromachining solutions for these applications developed by Electro Scientific Industries Inc. are presented here to highlight the growing demands for the UV laser technology and the rewarding benefits to the electronic interconnect and packaging applications

Keywords

integrated circuit interconnections; integrated circuit packaging; laser beam machining; micromachining; ultraviolet sources; 355 nm; UV laser technology; circuit board materials; electronic interconnect; electronic packaging; micromachining solutions; Drilling; Electronics packaging; Industrial electronics; Integrated circuit interconnections; Laser applications; Laser theory; Manufacturing industries; Micromachining; Semiconductor lasers; Solid lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564723

Filename

1564723