DocumentCode
2850495
Title
Molding Compound and Underfill Material Sets For A Molded Flip-Chip SIP Package
Author
Zhang, Jack ; Buckley, Michael ; Perabo, Chris ; Todd, Michael
Author_Institution
Henkel Technol., Irvine, CA
fYear
2005
fDate
2-2 Sept. 2005
Firstpage
1
Lastpage
5
Abstract
In this paper, performance of groups of underfill and molding compound material sets developed for a flip-chip SIP array package was evaluated. The failure modes were studied as variations of materials properties and processing conditions. Finite element analysis was conducted to provide theoretical support to the observations. It was found that both materials properties and process conditions had great impact on failure modes. A compatible underfill and molding compound material set as well as proper assembly process was the key to make a flip-chip SIP package failure-free
Keywords
finite element analysis; flip-chip devices; moulding; system-in-package; flip-chip package; molding compound material; system-in-package; underfill material sets; Application specific integrated circuits; Assembly; Conducting materials; Electronics packaging; Finite element methods; Integrated circuit packaging; Material properties; Plasma temperature; Qualifications; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location
Shenzhen
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564736
Filename
1564736
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