DocumentCode
2850527
Title
A study on statistical process control technology applied in reflow soldering processes
Author
Zhao-hua, Wu
Author_Institution
Dept. of Electron. Machinery & Transp. Eng., GuiLin Univ. of Electron. Technol., China
fYear
2005
fDate
30 Aug.-2 Sept. 2005
Firstpage
432
Lastpage
436
Abstract
SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.
Keywords
reflow soldering; statistical process control; MINITAB; reflow soldering processes; statistical process control; symbolic statistics; Assembly; Control charts; Inspection; Process control; Reflow soldering; Semiconductor device modeling; Statistics; Surface-mount technology; Temperature control; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564739
Filename
1564739
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