Title :
A study on statistical process control technology applied in reflow soldering processes
Author_Institution :
Dept. of Electron. Machinery & Transp. Eng., GuiLin Univ. of Electron. Technol., China
fDate :
30 Aug.-2 Sept. 2005
Abstract :
SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.
Keywords :
reflow soldering; statistical process control; MINITAB; reflow soldering processes; statistical process control; symbolic statistics; Assembly; Control charts; Inspection; Process control; Reflow soldering; Semiconductor device modeling; Statistics; Surface-mount technology; Temperature control; Temperature distribution;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564739
