DocumentCode :
2850589
Title :
Process management system analysis and design of SMT reflow soldering process
Author :
Chun-Quan, Li ; Zhao-hua, Wu
Author_Institution :
Dept. of Electron. Machinery & Transp. Eng., Guilin Univ. of Electron. Technol., China
fYear :
2005
fDate :
30 Aug.-2 Sept. 2005
Firstpage :
279
Lastpage :
284
Abstract :
Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.
Keywords :
process design; quality management; reflow soldering; surface mount technology; SMT processes management; SMT reflow soldering process; hardware design; long-distance temperature data transmission; process management software design; process management system; product quality; temperature data acquisition; Buildings; Data acquisition; Data analysis; Data communication; Real time systems; Reflow soldering; Software design; Surface-mount technology; System analysis and design; Temperature; SMT; process management; reflow soldering processes; system design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
Type :
conf
DOI :
10.1109/ICEPT.2005.1564743
Filename :
1564743
Link To Document :
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