DocumentCode
2850602
Title
Managing high-frequency signals with MCMs
Author
Powell, Jeff ; Durwood, Brian ; Ruttencutter, Paul
Author_Institution
Maxtek Components Corp., Beaverton, OR, USA
fYear
1998
fDate
15-17 Apr 1998
Firstpage
165
Lastpage
171
Abstract
This article discusses signal integrity problems and solutions. The authors explain typical barriers encountered by engineers as they push for ever higher frequencies, and the solutions available using multichip modules. The article then goes on to explain MCM design methodologies, materials and technologies and briefly describes an example of a high-frequency module
Keywords
VHF circuits; integrated circuit packaging; multichip modules; network synthesis; MCM design methodologies; MCM materials; MCM technologies; MCMs; high-frequency module; high-frequency signal management; multichip modules; signal frequency; signal integrity; Conducting materials; Costs; Design methodology; Distributed parameter circuits; Frequency; Multichip modules; Optical materials; Packaging; Solids; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-4850-8
Type
conf
DOI
10.1109/ICMCM.1998.670774
Filename
670774
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