Title :
Managing high-frequency signals with MCMs
Author :
Powell, Jeff ; Durwood, Brian ; Ruttencutter, Paul
Author_Institution :
Maxtek Components Corp., Beaverton, OR, USA
Abstract :
This article discusses signal integrity problems and solutions. The authors explain typical barriers encountered by engineers as they push for ever higher frequencies, and the solutions available using multichip modules. The article then goes on to explain MCM design methodologies, materials and technologies and briefly describes an example of a high-frequency module
Keywords :
VHF circuits; integrated circuit packaging; multichip modules; network synthesis; MCM design methodologies; MCM materials; MCM technologies; MCMs; high-frequency module; high-frequency signal management; multichip modules; signal frequency; signal integrity; Conducting materials; Costs; Design methodology; Distributed parameter circuits; Frequency; Multichip modules; Optical materials; Packaging; Solids; Thermal management;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670774
