DocumentCode :
2850607
Title :
Experiment study of temperature parameter effect on bonding process and quality in thermosonic wire bonding
Author :
Zhili, Long ; Lei, Han ; Yunxin, Wu ; Jue, Zhong
Author_Institution :
Coll. of Electromech. Eng., Central South Univ., Changsha, China
fYear :
2005
fDate :
30 Aug.-2 Sept. 2005
Firstpage :
408
Lastpage :
413
Abstract :
An experiment study of temperature parameter on bonding process and bonding quality in thermosonic wire bonding was performed in this paper. The experiment method was based on changing regularly bonding temperature and gaining the bonding strength by shearing gold ball joint by a high precision gauge. The experiment results and analysis can find out the relationship of bonding temperature and bonding strength, and get the temperature ultimate, favorite temperature window and bondability window at that bonding condition. Moreover, the experiment can find that the effect of temperature on impedance and power of PZT transducer in bonding process. These experiment phenomena and analysis results can be help to research on bonding parameters matching and optimization in thermosonic wire bonding.
Keywords :
lead bonding; piezoelectric transducers; PZT transducer; bonding process; bonding quality; bonding strength; bonding temperature; high precision gauge; temperature parameter effect; thermosonic wire bonding; Bonding processes; Current measurement; Gold; Impedance; Integrated circuit modeling; Packaging; Temperature; Transducers; Voltage; Wire; Bonding strength; Bonding temperature; Impedance of PZT transduecr; Power of PZT transducer; Thermosonic wire bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
Type :
conf
DOI :
10.1109/ICEPT.2005.1564744
Filename :
1564744
Link To Document :
بازگشت