Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering

Author

Chen, Yarong ; Tian, Yanhong ; Wang, Chunqing

Author_Institution

Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol.

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

4

Abstract

The interfacial reaction between Sn-Ag-Cu and Sn-Ag lead-free solder balls and Au/Ni/Cu pads in laser reflow process are presented in this paper. A continuous intermetallic compound layer and some needle-like AuSn₄ were observed at the interface of solder and pad, their morphology and distribution were strongly dependent on the laser input energy. Some voids were observed at the interface of solder joints when using laser as the heating source and they weakened the joints. The formation of voids maybe caused by the unique properties of laser

Keywords

gold alloys; interface phenomena; nickel alloys; reflow soldering; tin alloys; voids (solid); Au-Ni-Cu; AuSn₄; SnAgCu; continuous intermetallic compound layer; interfacial reaction; laser input energy; laser reflow soldering; lead free solder ball; voids formation; Atherosclerosis; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Heating; Laser theory; Lead; Power lasers; Reflow soldering; X-ray lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564748

Filename

1564748