Title :
A new solder bumping technology with local induction heating
Author :
Rong, An ; Li, Mingyu ; Wang, Chunqing
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., China
fDate :
30 Aug.-2 Sept. 2005
Abstract :
A solder bumping method with the local induction heating called ISHR(induction self heat reflow) is put forwarded in this paper, and reflow experiment to form solder bump for the SnPb, SnAg and SnAgCu eutectic solder ball on the Au/Ni/Cu pad is performed using the ISHR. Solder bump formation mechanism during the ISHR process is investigated. The results shows that it is appropriate to carry out solder bumping with the ISHR on Au/Ni/Cu pad, as well as the reflow time to form solder bump is shorter than traditional reflow method, commonly about 11 s. The formation process of the bump reflowed by the ISHR device is different from the ordinary reflow method.
Keywords :
copper; copper alloys; eutectic alloys; gold; induction heating; lead alloys; nickel; reflow soldering; silver alloys; tin alloys; Au-Ni-Cu; SnAgCu; SnPb; eutectic solder ball; formation process; induction self heat reflow; local induction heating; solder bump formation mechanism; solder bumping technology; Electromagnetic radiation; Environmentally friendly manufacturing techniques; Gold; Infrared heating; Lead; Materials science and technology; Optical microscopy; Packaging; Scanning electron microscopy; Space heating; Au/Ni; Bumping; induction; lead free;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564750
