A new solder bumping technology with local induction heating

Author

Rong, An ; Li, Mingyu ; Wang, Chunqing

Author_Institution

Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., China

fYear

2005

fDate

30 Aug.-2 Sept. 2005

Firstpage

394

Lastpage

397

Abstract

A solder bumping method with the local induction heating called ISHR(induction self heat reflow) is put forwarded in this paper, and reflow experiment to form solder bump for the SnPb, SnAg and SnAgCu eutectic solder ball on the Au/Ni/Cu pad is performed using the ISHR. Solder bump formation mechanism during the ISHR process is investigated. The results shows that it is appropriate to carry out solder bumping with the ISHR on Au/Ni/Cu pad, as well as the reflow time to form solder bump is shorter than traditional reflow method, commonly about 11 s. The formation process of the bump reflowed by the ISHR device is different from the ordinary reflow method.

Keywords

copper; copper alloys; eutectic alloys; gold; induction heating; lead alloys; nickel; reflow soldering; silver alloys; tin alloys; Au-Ni-Cu; SnAgCu; SnPb; eutectic solder ball; formation process; induction self heat reflow; local induction heating; solder bump formation mechanism; solder bumping technology; Electromagnetic radiation; Environmentally friendly manufacturing techniques; Gold; Infrared heating; Lead; Materials science and technology; Optical microscopy; Packaging; Scanning electron microscopy; Space heating; Au/Ni; Bumping; induction; lead free;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564750

Filename

1564750