Mechanism and control of linear positioning for IC wire bonders

Author

Li, Juan ; Liu, Yanjie ; Sun, Lining ; Jie, Degang

Author_Institution

Robotics Inst., Harbin Inst. of Technol., China

fYear

2005

fDate

30 Aug.-2 Sept. 2005

Firstpage

171

Lastpage

174

Abstract

Chip packaging is an important process during IC manufacturing, which determines the IC productivity and performance to a great extent. Wire bonders are key equipments of chip packaging. The development trend of high performance wire bonders leads to the needs that the positioning stage, which is the basic component used in wire bonders, possess high dynamic performance and high steady precision. Currently the positioning stage consists of the parallel mechanism and direct-drive linear servomotors. This paper firstly reviews the current development of wire bonders, and investigates the performance of linear positioning used in wire bonders. Secondly, various advanced linear drive components are compared, and it is can be concluded that voice coil motor is the most ideal actuator in wire bonders. Finally, the control methods used in linear motors are investigated and their applicability is indicated respectively.

Keywords

actuators; integrated circuit bonding; integrated circuit manufacture; integrated circuit packaging; lead bonding; linear motors; IC manufacturing; IC productivity; IC wire bonders; actuator; chip packaging; direct-drive linear servomotors; high dynamic performance; high steady precision; linear drive components; linear motors; linear positioning; voice coil motor; Acceleration; Bonding; Integrated circuit packaging; Manufacturing processes; Packaging machines; Productivity; Robots; Servomotors; Sun; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564751

Filename

1564751