Title :
Measurement Environment for Reliability Study of High Current First Level Interconnections
Author :
Barton, Zdenek ; Horky, Jiri ; Duda, Radoslav ; Szendiuch, Ivan ; Novotny, Marek ; Gevaert, Dorine
Author_Institution :
CEDO Ltd., Brno
Abstract :
Reliability of integrated circuits in electronic packages and connections is a major concern, due to the increasing die size, power dissipation and temperature. The extension of existing interconnection technologies towards higher current/power handling capabilities is a challenging and demanding task. In this paper a powerful system for experimental evaluation and reliability study for high current first level interconnections, up to 20 A, is presented. The system is used for evaluation of wire and flip-chip interconnections.
Keywords :
flip-chip devices; integrated circuit reliability; flip-chip interconnections; high current first level interconnections; integrated circuits reliability; measurement environment; power dissipation; reliability study; wire evaluation; Current measurement; Electronics packaging; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit reliability; Power dissipation; Power system interconnection; Power system reliability; Temperature; Packaging; contact degradation; electromigration; flip-chip; high current testing; integrated circuit; interconnection technology; reliability; wire bonding;
Conference_Titel :
Design and Test Workshop, 2007. IDT 2007. 2nd International
Conference_Location :
Cairo
Print_ISBN :
978-1-4244-1824-4
Electronic_ISBN :
978-1-4244-1825-1
DOI :
10.1109/IDT.2007.4437430
