• DocumentCode
    2851501
  • Title

    Black´s equation for today´s ULSI interconnect Electromigration reliability — A revisit

  • Author

    Wei Li ; Tan, Cher Ming

  • Author_Institution
    Singapore Inst. of Manuf. Technol., Singapore, Singapore
  • fYear
    2011
  • fDate
    17-18 Nov. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Electromigration (EM) is an important failure mechanism in Ultra-Large-Scale Integration (ULSI) interconnections. The Black´s equation is a simple empirical EM model, which is widely accepted in the industry as the most common method to extrapolate the median time to failure (MTF) from the accelerated test condition to the normal operating condition. Although the empirical model of the Black´s equation is simple in implementation, its validity has been a great controversy in the literature and will be described later. In this work, we revisit the Black´s equation for its success in the industry and its validity. In the presence of the additional driving forces and other important Electromigration physics which are not considered in the Black´s equation for today ULSI interconnects, the application of the Black´s equation for today´s ULSI interconnects become inaccurate as shown experimentally. An alternative model based on the physics-based Electromigration simulation and Eyring model in extrapolation is proposed in this work.
  • Keywords
    ULSI; electromigration; extrapolation; failure analysis; integrated circuit interconnections; integrated circuit reliability; non-Newtonian fluids; Black equation; Eyring model; ULSI interconnect electromigration reliability; accelerated testing; electromigration simulation; empirical electromigration model; failure mechanism; median time to failure; ultra large scale integration interconnections; Electromigration; Equations; Mathematical model; Predictive models; Stress; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2011 International Conference of
  • Conference_Location
    Tianjin
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-1998-1
  • Electronic_ISBN
    Pending
  • Type

    conf

  • DOI
    10.1109/EDSSC.2011.6117717
  • Filename
    6117717