• DocumentCode
    2852212
  • Title

    Influence analysis of soil resistivity to induced voltage and current for transmission systems

  • Author

    Duan, Xudong ; Wu, Guangning ; Cao, Baojiang ; Wu, Jingwen

  • Author_Institution
    Sch. of Electr. Eng., Southwest Jiaotong Univ., Chengdu, China
  • fYear
    2012
  • fDate
    24-27 June 2012
  • Firstpage
    528
  • Lastpage
    531
  • Abstract
    As UHV double-circuit and Multiple-Circuit transmission line corridor were widely set up, it made the interaction among the various systems of common corridor worse. It is a serious problem to the running stability and reliability of transmission line. The interactions include the induced voltage generated by electric field capacitive coupling, the induced electromotive force and induced current by magnetic field inductive coupling. In this paper, the software EMTP of electromagnetic transient simulation was used to analyze the induced voltage and current among transmission lines of Right-of-way. In a summary, induced electromotive force and induced current will be changed obviously in the condition of soil resistivity Within a certain range. The results provide advices for the selection and design of power transmission equipment.
  • Keywords
    electromagnetic coupling; electromagnetic forces; power system stability; power transmission lines; power transmission reliability; soil; EMTP software; UHV double-circuit; current analysis; electric field capacitive coupling; electromagnetic transient simulation; induced electromotive force; induced voltage analysis; magnetic field inductive coupling; multiple-circuit transmission line corridor; power transmission equipment design; soil resistivity analysis; transmission line reliability; transmission line stability; transmission systems; Conductivity; Educational institutions; Electrostatics; Force; Reliability; Soil; Induced Current; Induced Voltage; Multiple-Circuit Transmission Corridor; Simulation; Soil Resistivit;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical & Electronics Engineering (EEESYM), 2012 IEEE Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2363-5
  • Type

    conf

  • DOI
    10.1109/EEESym.2012.6258710
  • Filename
    6258710