DocumentCode :
2852798
Title :
Diagnose compound scan chain and system logic defects
Author :
Huang, Yu ; Hsu, Will ; Chen, Yuan-Shih ; Cheng, Wu-Tung ; Guo, Ruifeng ; Man, Albert
Author_Institution :
Mentor Graphics Corp., Marlborough, MA
fYear :
2007
fDate :
21-26 Oct. 2007
Firstpage :
1
Lastpage :
10
Abstract :
Scan based diagnosis can be of great help to guide physical failure analysis, which is critical for the success of silicon debug and yield ramp up. In practice, diagnosis becomes more difficult if scan chain defects and system logic defects co-exist on one die, which are called compound defects in this paper. We first describe the challenges in diagnosing this type of compound defects. A novel diagnosis flow is proposed to diagnose the compound defects on scan chain and system logic. The diagnosis methodology was successfully applied in industrial designs.
Keywords :
boundary scan testing; failure analysis; fault diagnosis; logic testing; compound defects; diagnosis flow; diagnosis methodology; physical failure analysis; scan based diagnosis; scan chain defects; system logic defects; Business; Failure analysis; Graphics; Hardware; Logic devices; Logic testing; Process design; Semiconductor device manufacture; Silicon; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
ISSN :
1089-3539
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
Type :
conf
DOI :
10.1109/TEST.2007.4437578
Filename :
4437578
Link To Document :
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