DocumentCode
2852798
Title
Diagnose compound scan chain and system logic defects
Author
Huang, Yu ; Hsu, Will ; Chen, Yuan-Shih ; Cheng, Wu-Tung ; Guo, Ruifeng ; Man, Albert
Author_Institution
Mentor Graphics Corp., Marlborough, MA
fYear
2007
fDate
21-26 Oct. 2007
Firstpage
1
Lastpage
10
Abstract
Scan based diagnosis can be of great help to guide physical failure analysis, which is critical for the success of silicon debug and yield ramp up. In practice, diagnosis becomes more difficult if scan chain defects and system logic defects co-exist on one die, which are called compound defects in this paper. We first describe the challenges in diagnosing this type of compound defects. A novel diagnosis flow is proposed to diagnose the compound defects on scan chain and system logic. The diagnosis methodology was successfully applied in industrial designs.
Keywords
boundary scan testing; failure analysis; fault diagnosis; logic testing; compound defects; diagnosis flow; diagnosis methodology; physical failure analysis; scan based diagnosis; scan chain defects; system logic defects; Business; Failure analysis; Graphics; Hardware; Logic devices; Logic testing; Process design; Semiconductor device manufacture; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
978-1-4244-1127-6
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2007.4437578
Filename
4437578
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