• DocumentCode
    2852798
  • Title

    Diagnose compound scan chain and system logic defects

  • Author

    Huang, Yu ; Hsu, Will ; Chen, Yuan-Shih ; Cheng, Wu-Tung ; Guo, Ruifeng ; Man, Albert

  • Author_Institution
    Mentor Graphics Corp., Marlborough, MA
  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Scan based diagnosis can be of great help to guide physical failure analysis, which is critical for the success of silicon debug and yield ramp up. In practice, diagnosis becomes more difficult if scan chain defects and system logic defects co-exist on one die, which are called compound defects in this paper. We first describe the challenges in diagnosing this type of compound defects. A novel diagnosis flow is proposed to diagnose the compound defects on scan chain and system logic. The diagnosis methodology was successfully applied in industrial designs.
  • Keywords
    boundary scan testing; failure analysis; fault diagnosis; logic testing; compound defects; diagnosis flow; diagnosis methodology; physical failure analysis; scan based diagnosis; scan chain defects; system logic defects; Business; Failure analysis; Graphics; Hardware; Logic devices; Logic testing; Process design; Semiconductor device manufacture; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437578
  • Filename
    4437578