• DocumentCode
    2852991
  • Title

    Combined effect of mechanical stressors and channel orientation on mobility in FDSOI n and p MOSFETs

  • Author

    Gamiz, Francisco ; Donetti, L. ; Rodriguez, N. ; Sampedro, C. ; Faynot, O. ; Barbe, J.C.

  • Author_Institution
    Nanoelectron. Res. Group, Univ. of Granada, Granada, Spain
  • fYear
    2012
  • fDate
    1-4 Oct. 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We have calculated the combined effect of biaxial and uniaxial strain in FDSOI MOSFETs for different channel orientations using a comprehensive Monte Carlo simulator. Our results confirm that tensile uniaxial strain improves the electron mobility of sSOI channels, with low impact of channel orientation, or silicon thickness, i.e., biaxial and uniaxial strains have cumulative effects. In the case of holes, the effect of compressive uniaxial strain strongly depends on the channel orientation and on the Ge mole fraction of the sSOI channel: for low xGe, compressive uniaxial strain enhances the hole mobility (cumulative effects); for high xGe, compressive uniaxial strain cancels the mobility enhancement achieved by the biaxial strain.
  • Keywords
    MOSFET; Monte Carlo methods; electron mobility; hole mobility; silicon-on-insulator; stress-strain relations; FDSOI nMOSFET; FDSOI pMOSFET; Ge; Monte Carlo simulator; SOI channels; biaxial strain effect; channel orientation; compressive uniaxial strain; electron mobility; hole mobility; mechanical stressors; silicon thickness; tensile uniaxial strain; uniaxial strain effect; Electron mobility; Silicon; Substrates; Tensile strain; Uniaxial strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2012 IEEE International
  • Conference_Location
    NAPA, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4673-2690-2
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2012.6404380
  • Filename
    6404380