A bead probe CAD strategy for in-circuit test

Author

Parker, Kenneth P. ; DeMille, Don

Author_Institution

Agilent Technol., Loveland, CO

fYear

2007

fDate

21-26 Oct. 2007

Firstpage

1

Lastpage

8

Abstract

Bead Probe Technology has been developed as alternative In-Circuit Test (ICT) contact points replacing conventional test pads normally integrated into a printed circuit layout [Park04], [Park05], [DoGr06], [Agil07]. This paper discusses the potential of using Bead Probes in Computer Aided Design (CAD) systems when getting a board ready for production. It outlines the requirements that a software package must address in order to incorporate Bead Probes into the board design process. Finally, a software package was developed to implement this process and evaluations were made on a number of circuit boards representing the industry sectors of communications, consumer electronics, military/aerospace and automotive. The evaluations provide insight into the ability of Bead Probes to enhance access, manage board stress, reduce cost and increase ICT test reliability.

Keywords

circuit CAD; circuit testing; software packages; bead probe CAD strategy; board design process; computer aided design; in-circuit test; printed circuit layout; software package; Aerospace industry; Circuit testing; Communication industry; Design automation; Integrated circuit technology; Printed circuits; Probes; Process design; Production systems; Software packages;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2007. ITC 2007. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

978-1-4244-1127-6

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2007.4437600

Filename

4437600