DocumentCode
2853117
Title
Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)
Author
Tee Chwee Liong ; Pascual, A.
Author_Institution
Test Dev. Eng. (Malaysia), Intel Kulim, Kulim
fYear
2007
fDate
21-26 Oct. 2007
Firstpage
1
Lastpage
10
Abstract
QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.
Keywords
X-ray applications; design; electronics packaging; inspection; solders; automated X-ray inspection; industry specification; inspection design; quad flat no lead package; solder joint defect detection; Automatic testing; Circuit testing; Electronic packaging thermal management; Electronics packaging; Humans; Inspection; Lead; Packaging machines; Soldering; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
978-1-4244-1127-6
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2007.4437601
Filename
4437601
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