A matched expansion MEMS probe card with low CTE LTCC substrate

Author

Choe, Seong-Hun ; Tanaka, Shuji ; Esashi, Masayoshi

Author_Institution

Dept. of Nanomechanics, Tohoku Univ., Sendai

fYear

2007

fDate

21-26 Oct. 2007

Firstpage

1

Lastpage

6

Abstract

This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/degC The probes are first formed on a silicon wafer, and then transferred to the LTCC substrate using Au/Sn solder bumps. The prototyped probe card was preliminarily evaluated in contact resistance. The measured contact resistance was 0.14 Omega during 2500 touchdowns.

Keywords

ceramics; large scale integration; thermal expansion; wafer level packaging; low CTE LTCC substrate; low temperature cofired ceramics substrate; matched expansion MEMS probe card; thermal expansion mismatch; Ceramics; Contact resistance; Fabrication; Large scale integration; Micromechanical devices; Probes; Silicon; Temperature; Testing; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2007. ITC 2007. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

978-1-4244-1127-6

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2007.4437618

Filename

4437618