Title :
A matched expansion MEMS probe card with low CTE LTCC substrate
Author :
Choe, Seong-Hun ; Tanaka, Shuji ; Esashi, Masayoshi
Author_Institution :
Dept. of Nanomechanics, Tohoku Univ., Sendai
Abstract :
This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/degC The probes are first formed on a silicon wafer, and then transferred to the LTCC substrate using Au/Sn solder bumps. The prototyped probe card was preliminarily evaluated in contact resistance. The measured contact resistance was 0.14 Omega during 2500 touchdowns.
Keywords :
ceramics; large scale integration; thermal expansion; wafer level packaging; low CTE LTCC substrate; low temperature cofired ceramics substrate; matched expansion MEMS probe card; thermal expansion mismatch; Ceramics; Contact resistance; Fabrication; Large scale integration; Micromechanical devices; Probes; Silicon; Temperature; Testing; Thermal expansion;
Conference_Titel :
Test Conference, 2007. ITC 2007. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1127-6
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2007.4437618
