DocumentCode
2854247
Title
A method for thermal resistance calculation of power module considering temperature effect on thermal conductivity
Author
Jinlei, Meng ; Xuhui, Wen ; Yulin, Zhong ; Liang, Kong
Author_Institution
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, 100190, China
Volume
1
fYear
2012
fDate
2-5 June 2012
Firstpage
245
Lastpage
248
Abstract
Thermal management is one of the most important aspects in power modules design and applications. Generally, the thermal conductivity is considered as a constant which is not true in practice. This paper proposes a novel analytical method considering temperature effect on thermal conductivities in thermal resistance calculation of power modules, and the method is verified by 3D FEM simulation. The method will help reduce the design complexity of power modules greatly.
Keywords
Conductivity; Finite element methods; Mathematical model; Multichip modules; Thermal conductivity; Thermal resistance; FEM; analytical method; thermal conductivity; thermal management; thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Motion Control Conference (IPEMC), 2012 7th International
Conference_Location
Harbin, China
Print_ISBN
978-1-4577-2085-7
Type
conf
DOI
10.1109/IPEMC.2012.6258838
Filename
6258838
Link To Document