Title :
A method for thermal resistance calculation of power module considering temperature effect on thermal conductivity
Author :
Jinlei, Meng ; Xuhui, Wen ; Yulin, Zhong ; Liang, Kong
Author_Institution :
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, 100190, China
Abstract :
Thermal management is one of the most important aspects in power modules design and applications. Generally, the thermal conductivity is considered as a constant which is not true in practice. This paper proposes a novel analytical method considering temperature effect on thermal conductivities in thermal resistance calculation of power modules, and the method is verified by 3D FEM simulation. The method will help reduce the design complexity of power modules greatly.
Keywords :
Conductivity; Finite element methods; Mathematical model; Multichip modules; Thermal conductivity; Thermal resistance; FEM; analytical method; thermal conductivity; thermal management; thermal resistance;
Conference_Titel :
Power Electronics and Motion Control Conference (IPEMC), 2012 7th International
Conference_Location :
Harbin, China
Print_ISBN :
978-1-4577-2085-7
DOI :
10.1109/IPEMC.2012.6258838
