• DocumentCode
    2854247
  • Title

    A method for thermal resistance calculation of power module considering temperature effect on thermal conductivity

  • Author

    Jinlei, Meng ; Xuhui, Wen ; Yulin, Zhong ; Liang, Kong

  • Author_Institution
    Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, 100190, China
  • Volume
    1
  • fYear
    2012
  • fDate
    2-5 June 2012
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    Thermal management is one of the most important aspects in power modules design and applications. Generally, the thermal conductivity is considered as a constant which is not true in practice. This paper proposes a novel analytical method considering temperature effect on thermal conductivities in thermal resistance calculation of power modules, and the method is verified by 3D FEM simulation. The method will help reduce the design complexity of power modules greatly.
  • Keywords
    Conductivity; Finite element methods; Mathematical model; Multichip modules; Thermal conductivity; Thermal resistance; FEM; analytical method; thermal conductivity; thermal management; thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Motion Control Conference (IPEMC), 2012 7th International
  • Conference_Location
    Harbin, China
  • Print_ISBN
    978-1-4577-2085-7
  • Type

    conf

  • DOI
    10.1109/IPEMC.2012.6258838
  • Filename
    6258838