Title :
Impact of MCMs on system performance optimization
Author :
Kayssi, A.I. ; Sakallah, K.A. ; Brown, R.B. ; Lomax, R.J. ; Mudge, T.N. ; Huff, T.R.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Presents a performance model for the University of Michigan MCM (multichip module)-based GaAs microcomputer. The model takes into account architectural as well as MCM packaging considerations such as the chip-to-substrate bonding method, the dielectric constant of the insulator, and the resistivity of the metal conductor. The authors illustrate the use of the model by finding the I-cache size which maximizes the MIPS (millions of instructions per second) rating for given MCM technology parameters
Keywords :
III-V semiconductors; microcomputers; multichip modules; packaging; GaAs; MCMs; chip-to-substrate bonding method; dielectric constant; multichip module; packaging considerations; resistivity; system performance optimization; technology parameters; Bonding; Conductivity; Conductors; Dielectric constant; Dielectrics and electrical insulation; Gallium arsenide; Metal-insulator structures; Microcomputers; Packaging; System performance;
Conference_Titel :
Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0593-0
DOI :
10.1109/ISCAS.1992.230071
