Title :
The TAD integrated crosspoint array
Author_Institution :
Wescon, Inc., Downers Grove, IL, USA
Abstract :
A 5 × 9 telephone crosspoint array with DIP packaging will be described. Cost, control, space, insertion loss, isolation, power consumption and comparative reliability advantages will be assessed.
Keywords :
Anodes; Costs; Dielectric losses; Dielectric substrates; Protection; Resistors; Semiconductor diodes; Switches; Switching circuits; Voltage;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1973 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1973.1155150
