DocumentCode
2855193
Title
Thermal analysis in SPICE
Author
Pokala, R.P. ; Divekar, D.
Author_Institution
Valid Logic Syst., San Jose, CA, USA
fYear
1989
fDate
5-9 Nov. 1989
Firstpage
256
Lastpage
259
Abstract
A discussion is presented of the implementation of thermal analysis in SPICE that analyzes the circuit by computing stability temperatures for each device at operating point in DC analysis. Conditions for thermal instability or thermal runway are discussed along with a critique of the current temperature models for some of the devices in SPICE. Thermal instability analysis, also implemented in SPICE, points out the specific devices in the circuit that lead to thermal instability.<>
Keywords
circuit analysis computing; thermal analysis; DC analysis; SPICE; operating point; stability temperatures; thermal analysis; thermal instability; thermal runway; Circuit simulation; Circuit synthesis; Electric resistance; Heat sinks; Heat transfer; Logic devices; Power dissipation; SPICE; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1989. ICCAD-89. Digest of Technical Papers., 1989 IEEE International Conference on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-8186-1986-4
Type
conf
DOI
10.1109/ICCAD.1989.76948
Filename
76948
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