DocumentCode :
2855615
Title :
A manufacturing-oriented environment for synthesis of fabrication processes
Author :
Wenstrand, J.S. ; Iwai, H. ; Dutton, R.W.
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
fYear :
1989
fDate :
5-9 Nov. 1989
Firstpage :
376
Lastpage :
379
Abstract :
The process design aid (PDA), a design environment which bridges the gap between design and specification of semiconductor fabrication processes, is presented. The PDA uses a hierarchical process model supporting reuse of well-characterized process fragments; integrates design goals with process and simulation data in a single knowledge base; and provides direct support for the numerical optimization of process parameters and simulator calibration parameters. Details of a hierarchical, object-oriented process representation are discussed. Results of modeling a 0.8- mu m BiCMOS process with the PDA are presented, demonstrating automatic generation of consistent simulation and manufacturing specifications, efficient incremental simulation, and fast, interactive, closed-loop optimization of process parameters.<>
Keywords :
BIMOS integrated circuits; circuit CAD; integrated circuit manufacture; object-oriented programming; optimisation; semiconductor technology; 0.8- mu m BiCMOS process; PDA; closed-loop optimization; default values; design goals; hierarchical process model; knowledge base; manufacturing specifications; manufacturing-oriented environment; numerical optimization; object-oriented process representation; process design aid; process parameters; semiconductor fabrication processes; simulation data; simulator calibration parameters; BiCMOS integrated circuits; Bridges; Calibration; Design optimization; Fabrication; Manufacturing automation; Manufacturing processes; Object oriented modeling; Process design; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 1989. ICCAD-89. Digest of Technical Papers., 1989 IEEE International Conference on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-8186-1986-4
Type :
conf
DOI :
10.1109/ICCAD.1989.76973
Filename :
76973
Link To Document :
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