Title : 
A comparison of technology trajectories between the global and the United States in smart grid
         
        
            Author : 
Lin, Siou-Zih ; Chen, Ssu-Han ; Wang, Chun-Chieh ; Chen, Dar-Zen
         
        
            Author_Institution : 
Grad. Inst. of Ind. Eng., Nat. Taiwan Univ. (NTU), Taipei, Taiwan
         
        
        
        
        
        
            Abstract : 
This study aims to compare the technology trajectories between the United States (U.S.) and the global nations in the smart grid field. Highly cited patents were collected from 2001/1/1 to 2010/12/31 and then were analyzed through bibliographic coupling method, sliding TCT-based citation window and Girvan-Newman clustering for being converted into a global technology trajectory map as well as a U.S. one. Firstly, results show that three of the global technology trajectories are time-lagged than its counterparts of the U.S. one, including electronic trading, dynamic power and workload management, and network monitoring through user profiles. Secondly, we found that two of the U.S. technology trajectories does exist but cannot be found in the global map, containing remote monitoring, automatic trading process and interface circuit system. Lastly, the conditional purchase offer management (CPO Management) and also the dynamic policy management (DPM) of the global trajectories are missing in the U.S. map.
         
        
            Keywords : 
power system management; smart power grids; CPO management; Girvan-Newman clustering; United States; bibliographic coupling method; conditional purchase offer management; dynamic policy management; electronic trading; remote monitoring; sliding TCT-based citation window; smart grid; technology trajectories; Computers; Couplings; Monitoring; Patents; Smart grids; Trajectory; Wireless LAN; Technology front; patent analysis; smart grid; technology trajectory;
         
        
        
        
            Conference_Titel : 
Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
         
        
            Conference_Location : 
Singapore
         
        
        
            Print_ISBN : 
978-1-4577-0740-7
         
        
            Electronic_ISBN : 
2157-3611
         
        
        
            DOI : 
10.1109/IEEM.2011.6118071