• DocumentCode
    285600
  • Title

    An approach to VLSI circuit reliability optimization considering the hot electron effects

  • Author

    Huang, Min ; Styblinski, M.A.

  • Author_Institution
    Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
  • Volume
    3
  • fYear
    1992
  • fDate
    10-13 May 1992
  • Firstpage
    1101
  • Abstract
    An approach to suppressing the degradation caused by hot electron effects is proposed in which releasing the stress of critical transistors by optimal parametric design is presented, and design-of-experiment techniques are used to improve its efficiency. An application to a VLSI sense amplifier is presented, in which a significant reduction in the hot electron induced delay shift is achieved. For the specific circuit considered, the proposed approach has led to a simpler practical method of VLSI circuit reliability improvement considering hot electron effects, in comparison with the generalized formulation of drift reliability optimization presented by M.A. Styblinski and M. Huang (1991)
  • Keywords
    VLSI; circuit reliability; hot carriers; integrated circuit technology; VLSI circuit; critical transistors; hot electron effects; induced delay shift; optimal parametric design; reliability optimization; sense amplifier; Circuit synthesis; Degradation; Electrons; Failure analysis; Hot carriers; MOSFETs; Performance evaluation; Stress measurement; Time measurement; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0593-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.1992.230287
  • Filename
    230287