Title :
High packing density LSI layout system with interactive facilities
Author :
Nakada, Yohei ; Yoshida, Kenta ; Kawakami, Shojiro ; Koike, Masakazu
Author_Institution :
Tokyo Shibaura Electric Co., Ltd., Kawasaki, Japan
Abstract :
LSI chip area and design time, reduced by improving automatic layout programs and by combining them with interactive refining techniques, will be discussed. Packing density of layouts has been found to be at least equal to that of manual designs.
Keywords :
Application software; Cathode ray tubes; Design automation; Displays; Integrated circuit interconnections; Large scale integration; Libraries; Man machine systems; Routing; Wiring;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1974.1155239
