• DocumentCode
    2856607
  • Title

    A Simulator for Multi-Core Processor Micro-Architecture Featuring Inter-Core Communication, Power and Thermal Behavior

  • Author

    Xu, Jun ; Zhu, Yongxin ; Jiang, Lei ; Ni, Junjie ; Zheng, Kai

  • Author_Institution
    Sch. of Microelectron., Shanghai Jiao Tong Univ., Shanghai
  • fYear
    2008
  • fDate
    29-31 July 2008
  • Firstpage
    237
  • Lastpage
    242
  • Abstract
    To effectively evaluate thermal behavior and inter-core communication on multi-core processors, we propose a simulation methodology and the corresponding implementation with runtime power and temperature calculation in this paper. The multi-core simulator is extended from our previous work, i.e. a heteromerous dual-core simulator. In our updated simulator, the well-established power model Wattch and a transient thermal simulation algorithm TILTS are integrated. The simulator is able to provide the runtime power and temperature metrics with little additional overhead compared with the original performance simulator. These results are illustrated with multimedia applications making use of all cores via inter-core communications. As far as we learn, we would like to highlight that our simulator is the first multi-core processor simulator based on SimpleScalar with thermal behavior and inter-core communication enabled. This simulator must be helpful for processor architects to make early decisions on thermal and performance trade-offs.
  • Keywords
    microprocessor chips; performance evaluation; intercore communication; multicore processor microarchitecture; multicore simulator; temperature calculation; transient thermal simulation algorithm; Analytical models; Conferences; Embedded software; Microelectronics; Multicore processing; Performance loss; Power system modeling; Runtime; Temperature; Testing; inter-core communication; multi-core processor; power; simulator; thermal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded Software and Systems Symposia, 2008. ICESS Symposia '08. International Conference on
  • Conference_Location
    Sichuan
  • Print_ISBN
    978-0-7695-3288-2
  • Type

    conf

  • DOI
    10.1109/ICESS.Symposia.2008.86
  • Filename
    4627164