DocumentCode :
2856667
Title :
Implications of LSI
Author :
Haddad, Jack
Author_Institution :
IBM System Product Div., White Plain, NY, USA
Volume :
XVII
fYear :
1974
fDate :
15-13 Feb. 1974
Firstpage :
50
Lastpage :
51
Abstract :
The dramatic increase in density of circuits on silicon chips has important and far-reaching implications for the design process, reliability, power, cost, manufacturing, and nature and functions of end products, based on LSI technologies. Today, 250 microinch (6μm) geometries are common; 150 microinch (4μm) geometries are in current commercial use. In the next ten years, LSI could be based on 25-60 microinch (0.6 - 1.5μm) geometries. Why, Wherein lies the value of such technologies? How will these technologies affect end products, the manner in which the products are designed, manufactured and tested, and the way people will use them?
Keywords :
Circuit testing; Cost function; Design automation; Graphics; Investments; Large scale integration; Logic circuits; Logic design; Packaging; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location :
Philadelphia, PA, USA
Type :
conf
DOI :
10.1109/ISSCC.1974.1155264
Filename :
1155264
Link To Document :
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