DocumentCode :
2856668
Title :
Analysis and design of LVTSCR-based EOS/ESD protection circuits for burn-in environment
Author :
Semenov, O. ; Sarbishaei, H. ; Sachdev, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
fYear :
2005
fDate :
21-23 March 2005
Firstpage :
427
Lastpage :
432
Abstract :
As technology feature size is reduced, ESD becomes one of the dominant failure modes due to the lower gate oxide breakdown voltage. Also, the holding voltage of LVTSCR devices is reduced with operating temperature increase. As a result, during stress testing (burn-in), the risk of latch-up in LVTSCR is extremely high. In this paper, a new latch-up free LVTSCR-based protection circuit is proposed. It can be reliably used in sub-0.18 μm CMOS technologies and burn-in environment. The proposed ESD circuit has higher holding voltage by 1.5× than the conventional LVTSCR structure at burn-in temperature. Under 3 kV HBM ESD stress, the developed LVTSCR-based protection circuit has the voltage peak less than the conventional LVTSCR structure and GG-MOSFET by 2× and 1.25×, respectively.
Keywords :
CMOS logic circuits; electrostatic discharge; integrated circuit design; logic testing; 3 kV; EOS/ESD protection circuits; LVTSCR; burn-in environment; failure modes; gate oxide breakdown voltage; holding voltage; latch-up; operating temperature increase; stress testing; sub-0.18 μm CMOS technologies; CMOS technology; Circuit simulation; Earth Observing System; Electrostatic discharge; Ovens; Protection; Semiconductor diodes; Stress; Temperature; Voltage; Electrostatic discharge (ESD); LVTSCR; burn-in; electrical overstress (EOS); latch-up;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on
Print_ISBN :
0-7695-2301-3
Type :
conf
DOI :
10.1109/ISQED.2005.17
Filename :
1410620
Link To Document :
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