A Low Temperature Cofired Ceramic (LTCC) technology platform for heterogeneous integrated systems

Author

Blanes, M. ; Fernández, J.M. ; López, C. ; Ramos, F. ; Afsar, F. ; Carrasco, T. ; Cirera, A. ; Giordano, F. ; López-Villegas, J.M. ; Macías, J.G. ; Sieiro, J. ; Vidal, N.

Author_Institution

FAE-Francisco Albero S.A., L´´Hospitalet de Llobregat, Spain

fYear

2011

fDate

8-11 Feb. 2011

Firstpage

1

Lastpage

4

Abstract

A LTCC technology platform for the integration of heterogeneous electronic systems is presented. The reliability of technical processes and the RF characterization of basic structures shows a very good performance (permittivity, ε_r ~ 6.1, loss tangent <; 0.002) that allows the integration of complex systems based on the System in Package (SiP) concept. As a demonstrator, it has been implemented a quadrature VCO with embedded passive devices showing a 45% tuning range.

Keywords

ceramic packaging; system-in-package; LTCC technology platform; RF characterization; embedded passive devices; heterogeneous electronic systems; heterogeneous integrated systems; low temperature cofired ceramic; quadrature VCO; reliability; system in package; technical processes; Conferences; Electron devices; LTCC; SiP; embedded passives; heterogeneous system integration; inductors; transformers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices (CDE), 2011 Spanish Conference on

Conference_Location

Palma de Mallorca

Print_ISBN

978-1-4244-7863-7

Type

conf

DOI

10.1109/SCED.2011.5744173

Filename

5744173