DocumentCode
2857818
Title
Invited: Modern MOS semiconductor processing methods
Author
Sevin, L.
Author_Institution
Mostek Corp., Carrollton, TX, USA
Volume
XVII
fYear
1974
fDate
15-13 Feb. 1974
Firstpage
108
Lastpage
109
Abstract
A recently completed 3" MOS-LSI wafer processing facility will be described, including ion implantation, automatic wafer handling, automatic mask allignment and design automation aids. Emphasis will be on techniques useful in LSI design and processing.
Keywords
Boats; Circuit testing; Costs; Electronic components; Large scale integration; MOSFETs; Manufacturing processes; Marketing and sales; Resists; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1974.1155338
Filename
1155338
Link To Document