DocumentCode
2858128
Title
Wafer lot release policies based on the continuous and periodic review of WIP levels
Author
El-Kilany, Khaled S.
Author_Institution
Dept. of Ind. & Manage. Eng., Arab Acad. for Sci., Technol. & Maritime Transp. (AASTMT), Alexandria, Egypt
fYear
2011
fDate
6-9 Dec. 2011
Firstpage
1700
Lastpage
1704
Abstract
This paper evaluates the impact of different lot release policies on the performance of semiconductor wafer fabrication facilities (wafer fabs). Lot release policies presented in this work are based on continuous review and periodic review inventory control policies. Proposed policies can be considered as modifications to the well known CONstant Work-In-Process (CONWIP) method. Simulation of the Intel Mini-Fab model is used to compare the performance of the fab using the CONWIP method to using these proposed policies. Additionally, two different dispatching rules are used at the bottleneck station to evaluate its impact on the fab performance when combined with the release policies. Performance is measured using an overall efficiency measure to represent the changes that occur in both cycle time and throughput rate. The work shows that periodic WIP review can improve the performance of the fab; while, continuous WIP review will have the same effect of the CONWIP method.
Keywords
semiconductor industry; semiconductor technology; stock control; work in progress; CONWIP method; Intel minifab model; WIP level review; constant work-in-process; continuous review inventory control policy; cycle time; dispatching rule; periodic review inventory control policy; semiconductor wafer fabrication facility; throughput rate; wafer lot release policy; Computed tomography; Dispatching; Fabrication; Job shop scheduling; Semiconductor device modeling; Throughput; Lot release policies; modeling and simulation; semiconductor manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
Conference_Location
Singapore
ISSN
2157-3611
Print_ISBN
978-1-4577-0740-7
Electronic_ISBN
2157-3611
Type
conf
DOI
10.1109/IEEM.2011.6118206
Filename
6118206
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