• DocumentCode
    2858128
  • Title

    Wafer lot release policies based on the continuous and periodic review of WIP levels

  • Author

    El-Kilany, Khaled S.

  • Author_Institution
    Dept. of Ind. & Manage. Eng., Arab Acad. for Sci., Technol. & Maritime Transp. (AASTMT), Alexandria, Egypt
  • fYear
    2011
  • fDate
    6-9 Dec. 2011
  • Firstpage
    1700
  • Lastpage
    1704
  • Abstract
    This paper evaluates the impact of different lot release policies on the performance of semiconductor wafer fabrication facilities (wafer fabs). Lot release policies presented in this work are based on continuous review and periodic review inventory control policies. Proposed policies can be considered as modifications to the well known CONstant Work-In-Process (CONWIP) method. Simulation of the Intel Mini-Fab model is used to compare the performance of the fab using the CONWIP method to using these proposed policies. Additionally, two different dispatching rules are used at the bottleneck station to evaluate its impact on the fab performance when combined with the release policies. Performance is measured using an overall efficiency measure to represent the changes that occur in both cycle time and throughput rate. The work shows that periodic WIP review can improve the performance of the fab; while, continuous WIP review will have the same effect of the CONWIP method.
  • Keywords
    semiconductor industry; semiconductor technology; stock control; work in progress; CONWIP method; Intel minifab model; WIP level review; constant work-in-process; continuous review inventory control policy; cycle time; dispatching rule; periodic review inventory control policy; semiconductor wafer fabrication facility; throughput rate; wafer lot release policy; Computed tomography; Dispatching; Fabrication; Job shop scheduling; Semiconductor device modeling; Throughput; Lot release policies; modeling and simulation; semiconductor manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
  • Conference_Location
    Singapore
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4577-0740-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2011.6118206
  • Filename
    6118206