Title :
Mechanical integrity issues of MCM-Cs for high reliability applications
Author :
Morgenstern, Howard ; Tarbutton, Tom ; Becka, Gary
Author_Institution :
AlliedSignal Fed. Manuf. & Technol., Kansas City, MO, USA
Abstract :
During the qualification of a new high reliability low-temperature cofired ceramic (LTCC) multichip module (MCM), two issues relating to the electrical and mechanical integrity of the LTCC network were encountered while performing qualification testing. One was electrical opens after aging tests that were caused by cracks in the solder joints. The other was fracture of the LTCC networks during mechanical testing. Through failure analysis, computer modeling, bend testing, and test samples, the required changes were identified. Upon implementation of all these changes, the modules passed testing, and the MCM was placed into production
Keywords :
ageing; bending; ceramics; circuit analysis computing; cracks; failure analysis; fracture; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; mechanical testing; multichip modules; soldering; LTCC network; LTCC network fracture; MCM production; MCM-Cs; aging tests; bend testing; computer modeling; electrical integrity; electrical opens; failure analysis; high reliability applications; low-temperature cofired ceramic MCM; mechanical integrity; mechanical integrity issues; mechanical testing; multichip module; qualification testing; solder joint cracks; solder joints; Aging; Ceramics; Failure analysis; Manufacturing; Multichip modules; Performance evaluation; Qualifications; Testing; Thick films; Vehicles;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670826
