• DocumentCode
    2858268
  • Title

    Spiral inductors integrated in MCM-D using the design space concept

  • Author

    Pieters, Philip ; Beyne, Eric

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    1998
  • fDate
    15-17 Apr 1998
  • Firstpage
    478
  • Lastpage
    483
  • Abstract
    High quality integrated spiral inductors are essential components of integrated microwave applications such as passive filters. In order to be able to determine the specific inductor geometry that provides the highest possible quality factor for a given inductance value and frequency behaviour, the concept of inductor design spaces is introduced. These design spaces link inductor quality factors with inductance values and frequency ranges. Using a new theoretical inductor model that allows the prediction of the behaviour of any coplanar multi-turn circular spiral inductor on a thin film multilayer MCM-D structure, the design spaces may be explored for the geometries that produce the highest quality factors. The paper describes both the calculation of the inductor model and the use of the design space concept. Finally, the application of this concept for the design of passive filters is indicated
  • Keywords
    Q-factor; inductance; inductors; microwave filters; microwave integrated circuits; multichip modules; passive filters; MCM-D; coplanar multi-turn circular spiral inductor; design space concept; frequency behaviour; inductance value; inductor design spaces; inductor geometry; inductor model; inductor quality factor; integrated microwave applications; integrated spiral inductors; passive filter design; passive filters; quality; quality factor; thin film multilayer MCM-D structure; Frequency; Geometry; Inductance; Nonhomogeneous media; Passive filters; Predictive models; Q factor; Solid modeling; Spirals; Thin film inductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-4850-8
  • Type

    conf

  • DOI
    10.1109/ICMCM.1998.670827
  • Filename
    670827