MCM-L requirements for an automotive electronic control unit application

Author

Joly, J. ; Lambert, D. ; Hunt, J.

Author_Institution

Bull SA, Les Clayes-sous-Bois, France

fYear

1998

fDate

15-17 Apr 1998

Firstpage

531

Lastpage

536

Abstract

MCMs offer an attractive alternative to packaged components to increase the packaging density and the reliability of electronic functions in a harsh environment, and decrease the overall cost. In the first part of this paper, we show the results of reliability tests carried out on test vehicles to select from the possible technological choices-high T_g FR4 vs. BT resin base substrate materials; wire bonding vs. flip chip processing for VLSI assembly on the MCM-L; and glob top encapsulation vs. metal lid die protection technology-to find the technologies which best fulfil automotive requirements for under the hood applications at a competitive cost. In the second part of the paper, we describe a functional MCM-L/ball grid array (BGA) electronic control unit (ECU) built with the materials and processes selected

Keywords

automotive electronics; electric control equipment; encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; laminates; lead bonding; multichip modules; plastic packaging; polymer films; BT resin base substrate materials; FR4 base substrate materials; MCM-L; MCM-L/BGA ECU; MCM-L/ball grid array electronic control unit; MCMs; VLSI assembly; automotive electronic control unit application; automotive requirements; cost competitiveness; electronic functions; electronics costs; flip chip processing; glass transition temperature; glob top encapsulation; harsh environment; metal lid die protection; packaged components; packaging density; reliability; reliability tests; test vehicles; under the hood applications; wire bonding; Automotive electronics; Bonding; Cost function; Electronics packaging; Flip chip; Resins; Testing; Vehicles; Very large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670837

Filename

670837