Title :
A process model of the infra-red reflow soldering of printed circuit assemblies
Author :
Whalley, David C. ; Conway, Paul P. ; Williams, David J.
Author_Institution :
Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK
Abstract :
Outlines the results of a major project to demonstrate the pre-production simulation of thermal processes used in the assembly of printed circuit boards. A study of the limitations of this project is also summarised. These limitations have allowed the definition of a further project which aims to produce a more complete modelling tool supported by sufficient experimentally gathered process data to allow confident interpretation of the modelling results
Keywords :
assembling; computer aided analysis; electronic engineering computing; printed circuit manufacture; production engineering computing; soldering; thermal analysis; IR reflow soldering; assembly; modelling tool; preproduction simulation; printed circuit boards; thermal process model;
Conference_Titel :
CAD (Computer Aided Design) Tools for Thermal Management, IEE Colloquium on (Digest No.027)
Conference_Location :
London
