Title :
An analytical technique for process analysis
Author_Institution :
Physical Electronics Industries, Inc., Eden Prairie, MN, USA
Abstract :
A new thin-film analysis technique, Auger electron spectroscopy, with ion sputter etching, has been used to determine the three-dimensional elemental composition of a solid. Integrated circuit processing applications of the technique, which relate changes in the electrical device parameters with changes in the surface and interfacial composition of thin-film LSI structures, will be described.
Keywords :
Atomic measurements; Electron beams; Electronics industry; Large scale integration; Performance analysis; Process control; Production; Solids; Sputter etching; Sputtering;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1975 IEEE International
DOI :
10.1109/ISSCC.1975.1155405
