DocumentCode
2859789
Title
Impedance mismatch and lumped capacitance effects in high frequency testing
Author
Sylla, Iboun T. ; Slamani, Mustapha ; Kaminska, Bozena ; Hossein, Fartoumi M. ; Vincent, Patrick
Author_Institution
Ecole Polytech. de Montreal, Que., Canada
fYear
1998
fDate
26-30 Apr 1998
Firstpage
239
Lastpage
244
Abstract
Working at high frequency adds to VLSI designers and test engineers many constraints. Many effects which are insignificant at low frequency domain have to be taken into account. These effects alternate considerably the precision of the test, introducing the a new challenge to the test community. The impedance mismatch between the circuit under test output impedance and the characteristic impedance of the transmission line as well as the effect of the lumped capacitance at the input of the tester comparator are among the most important effects. These two effects result as ringings, overshoot and timing delay. In this paper we present a method to eliminate the aberrations of the transmission line effects as well as the influence of the lumped capacitance at the input of the DUT thereby improving the precision of the rest
Keywords
VLSI; automatic test equipment; automatic testing; delays; high-frequency transmission lines; impedance matching; integrated circuit testing; VLSI designers; aberrations; characteristic impedance; high frequency testing; impedance mismatch; low frequency domain; lumped capacitance; lumped capacitance effects; overshoot; ringings; test engineers; timing delay; transmission line; transmission line effects; Capacitance; Circuit testing; Delay effects; Design engineering; Distributed parameter circuits; Frequency domain analysis; Impedance; Timing; Transmission lines; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 1998. Proceedings. 16th IEEE
Conference_Location
Monterey, CA
ISSN
1093-0167
Print_ISBN
0-8186-8436-4
Type
conf
DOI
10.1109/VTEST.1998.670875
Filename
670875
Link To Document