Title :
Minimum package parasitics for microwave devices
Author :
Pitzalis, O., Jr.
Author_Institution :
US Army Electronics Command, Fort Monmouth, NJ, USA
Abstract :
As the operation of microwave devices is pushed to higher powers and frequencies, the mechanical and electrical interface between device and circuit becomes increasingly more important. Traditional wirebonding technology will be compared to alternate, more promising methods.
Keywords :
Bonding; Electronics packaging; Impedance matching; Integrated circuit interconnections; Microwave devices; Microwave transistors; Power transistors; Reproducibility of results; Semiconductor device packaging; Wire;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1976 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1976.1155510
