DocumentCode :
2860813
Title :
Crosstalk analysis of carbon nanotube bundle interconnects
Author :
Zhang, Kailiang ; Tian, Bo ; Zhu, Xiaosong ; Wang, Fang ; Wei, Jun
Author_Institution :
Sch. of Electron. Inf. Eng., Tianjin Univ. of Technol., Tianjin, China
fYear :
2011
fDate :
21-24 June 2011
Firstpage :
1
Lastpage :
2
Abstract :
In this paper, the interconnect parameters for a carbon nanotube (CNT) bundle are calculated first, then the equivalent circuit has been developed to perform the crosstalk analysis and in the end the main influencing factors are discussed. On the basis of simulation which is completed by simulation software SPICE, crosstalk voltage can be decreased by increasing spacing between adjacent lines, setting the appropriate position when the length is fixed, decreasing line length and selecting the appropriate frequency.
Keywords :
carbon nanotubes; crosstalk; equivalent circuits; integrated circuit design; integrated circuit interconnections; C; CNT bundle interconnect parameter; SPICE software simulation; adjacent lines; carbon nanotube bundle interconnect parameter; crosstalk analysis; crosstalk voltage; equivalent circuit; Capacitance; Carbon nanotubes; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; SPICE; Wires; SPICE; carbon nanotube (CNT); crosstalk; interconnects; nanotechnology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2011 IEEE 4th International
Conference_Location :
Tao-Yuan
ISSN :
2159-3523
Print_ISBN :
978-1-4577-0379-9
Electronic_ISBN :
2159-3523
Type :
conf
DOI :
10.1109/INEC.2011.5991635
Filename :
5991635
Link To Document :
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