Title :
Crosstalk analysis of carbon nanotube bundle interconnects
Author :
Zhang, Kailiang ; Tian, Bo ; Zhu, Xiaosong ; Wang, Fang ; Wei, Jun
Author_Institution :
Sch. of Electron. Inf. Eng., Tianjin Univ. of Technol., Tianjin, China
Abstract :
In this paper, the interconnect parameters for a carbon nanotube (CNT) bundle are calculated first, then the equivalent circuit has been developed to perform the crosstalk analysis and in the end the main influencing factors are discussed. On the basis of simulation which is completed by simulation software SPICE, crosstalk voltage can be decreased by increasing spacing between adjacent lines, setting the appropriate position when the length is fixed, decreasing line length and selecting the appropriate frequency.
Keywords :
carbon nanotubes; crosstalk; equivalent circuits; integrated circuit design; integrated circuit interconnections; C; CNT bundle interconnect parameter; SPICE software simulation; adjacent lines; carbon nanotube bundle interconnect parameter; crosstalk analysis; crosstalk voltage; equivalent circuit; Capacitance; Carbon nanotubes; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; SPICE; Wires; SPICE; carbon nanotube (CNT); crosstalk; interconnects; nanotechnology;
Conference_Titel :
Nanoelectronics Conference (INEC), 2011 IEEE 4th International
Conference_Location :
Tao-Yuan
Print_ISBN :
978-1-4577-0379-9
Electronic_ISBN :
2159-3523
DOI :
10.1109/INEC.2011.5991635