DocumentCode
286093
Title
Lasers in electronics manufacturing-an industrial view
Author
Ridler, A.D.
Author_Institution
Inernational Computers Ltd., Stoke-on-Trent, UK
fYear
1993
fDate
34078
Firstpage
42491
Lastpage
42493
Abstract
The author compares and contrasts two laser technologies: a YAG based network system for removing and replacing soldered electronic devices and an excimer based plastics machining system. Three applications are identified: inner layers with through via holes; surface vias contained within surface mount bands; and, multichip modules with blind vias
Keywords
electronics industry; integrated circuit manufacture; laser beam machining; multichip modules; printed circuit manufacture; PCB manufacture; YAG based network system; YAl5O12; blind vias; electronics manufacturing; excimer based plastics machining system; inner layers; laser beam machining; laser technologies; multichip modules; soldered electronic devices; surface mount bands; surface vias; through via holes;
fLanguage
English
Publisher
iet
Conference_Titel
Laser Applications, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
231098
Link To Document